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電(dian)(dian)源(yuan)(yuan)管(guan)(guan)理(li)芯片(pian)代理(li)商:nxp電(dian)(dian)源(yuan)(yuan)管(guan)(guan)理(li)芯片(pian)代理(li)商的(de)(de)轉化(hua)及(ji)驅動開關,首要擔任辨認CPU供電(dian)(dian)起(qi)伏(fu),產生相(xiang)應的(de)(de)短矩波(bo),促進后續電(dian)(dian)路的(de)(de)功率輸出(chu),包(bao)含電(dian)(dian)源(yuan)(yuan)轉化(hua)、配電(dian)(dian)和檢測(ce),以及(ji)電(dian)(dian)源(yuan)(yuan)轉化(hua)和電(dian)(dian)源(yuan)(yuan)管(guan)(guan)理(li)相(xiang)結合的(de)(de)體系。相(xiang)應地,電(dian)(dian)源(yuan)(yuan)管(guan)(guan)理(li)芯片(pian)代理(li)商的(de)(de)分類包(bao)含其他方(fang)面,如線性電(dian)(dian)源(yuan)(yuan)芯片(pian)、電(dian)(dian)壓基準芯片(pian)、開關電(dian)(dian)源(yuan)(yuan)芯......
了解更多 [06-22]現(xian)有(you)各(ge)類電(dian)(dian)源(yuan)(yuan)管(guan)(guan)(guan)(guan)理(li)(li)的(de)差異,具體使(shi)用(yong)中怎么選(xuan)擇(ze)合適的(de)電(dian)(dian)源(yuan)(yuan)管(guan)(guan)(guan)(guan)理(li)(li)?實驗室常用(yong)的(de)分立(li)式(shi)電(dian)(dian)源(yuan)(yuan)管(guan)(guan)(guan)(guan)理(li)(li)或(huo)軸向引線電(dian)(dian)源(yuan)(yuan)管(guan)(guan)(guan)(guan)理(li)(li)。但在電(dian)(dian)源(yuan)(yuan)管(guan)(guan)(guan)(guan)理(li)(li)和(he)膜(mo)厚方(fang)面(mian),電(dian)(dian)源(yuan)(yuan)管(guan)(guan)(guan)(guan)理(li)(li)芯片代(dai)理(li)(li)商能夠在性能上(shang)對比電(dian)(dian)網上(shang)的(de)價格。最常用(yong)的(de)有(you)三種:合成碳膜(mo)電(dian)(dian)源(yuan)(yuan)管(guan)(guan)(guan)(guan)理(li)(li)或(huo)碳膜(mo)電(dian)(dian)源(yuan)(yuan)管(guan)(guan)(guan)(guan)理(li)(li)、金屬膜(mo)電(dian)(dian)源(yuan)(yuan)管(guan)(guan)(guan)(guan)理(li)(li)和(he)繞線電(dian)(dian)源(yuan)(yuan)管(guan)(guan)(guan)(guan)理(li)(li)。nxp電(dian)(dian)源(yuan)(yuan)管(guan)(guan)(guan)(guan)理(li)(li)芯片和(he)碳電(dian)(dian)源(yuan)(yuan)......
了解更多 [06-21]?電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)管理芯(xin)(xin)片(pian)用(yong)于集成電(dian)(dian)(dian)(dian)(dian)(dian)(dian)路(lu)IC,用(yong)于電(dian)(dian)(dian)(dian)(dian)(dian)(dian)子設備系統中作(zuo)為電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)管理芯(xin)(xin)片(pian)進行電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)轉換(huan)、分配、檢測等。它主(zhu)要負(fu)責將電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)壓(ya)和(he)(he)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)流(liu)轉換(huan)為可供微處理器(qi)、傳(chuan)感器(qi)和(he)(he)其他負(fu)載運用(yong)的電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)。nxp電(dian)(dian)(dian)(dian)(dian)(dian)(dian)源(yuan)管理芯(xin)(xin)片(pian)是固定片(pian)式(shi)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)阻器(qi)和(he)(he)矩形片(pian)式(shi)電(dian)(dian)(dian)(dian)(dian)(dian)(dian)阻器(qi)的縮(suo)寫。它是一種(zhong)金屬(shu)玻璃釉電(dian)(dian)(dian)(dian)(dian)(dian)(dian)阻。它主(zhu)要由基板、電(dian)(dian)(dian)(dian)(dian)(dian)(dian)阻膜、保護膜和(he)(he)......
了解更多 [06-20]電(dian)(dian)源管理芯片具有獨(du)有的電(dian)(dian)熱(re)(re)物理特性:當電(dian)(dian)源管理芯片對組件施加(jia)(jia)溝通電(dian)(dian)壓加(jia)(jia)熱(re)(re)時,其電(dian)(dian)阻率(lv)十分低居(ju)里(li)溫(wen)(wen)度(du)以下,當電(dian)(dian)阻率(lv)忽(hu)然升高到(dao)居(ju)里(li)溫(wen)(wen)度(du)以上時,電(dian)(dian)流下降到(dao)一個恒定值,自(zi)動控制(zhi)溫(wen)(wen)度(du)和恒溫(wen)(wen)功(gong)能(neng)。發(fa)(fa)熱(re)(re)體(ti)受(shou)熱(re)(re)后,通過熱(re)(re)傳(chuan)導將(jiang)熱(re)(re)量傳(chuan)遞到(dao)工(gong)作面,完成燙發(fa)(fa)使命(ming)。直發(fa)(fa)器的工(gong)作面通常運(yun)用陶瓷或鋁(lv)板(ban)。鋁(lv)板(ban)......
了解更多 [06-18]為(wei)了(le)添加電(dian)(dian)路的(de)密度,電(dian)(dian)源(yuan)管(guan)理芯片代理商的(de)特(te)征與尺度一(yi)(yi)直在(zai)減(jian)小,電(dian)(dian)場(chang)強度隨著間(jian)隔(ge)的(de)減(jian)小而線性(xing)添加。為(wei)了(le)在(zai)下降電(dian)(dian)壓(ya)的(de)一(yi)(yi)起(qi)(qi)保(bao)持高(gao)(gao)效(xiao)率,nxp電(dian)(dian)源(yuan)管(guan)理芯片一(yi)(yi)般選用降壓(ya)型開關電(dian)(dian)源(yuan)一(yi)(yi)起(qi)(qi),許多電(dian)(dian)子體(ti)系也需求(qiu)高(gao)(gao)于電(dian)(dian)源(yuan)電(dian)(dian)壓(ya)的(de)電(dian)(dian)源(yuan)。此外(wai),現代電(dian)(dian)子體(ti)系正(zheng)朝(chao)著高(gao)(gao)速、高(gao)(gao)增益(yi)、高(gao)(gao)可靠性(xing)的(de)方向發(fa)展(zhan)。上述不同的(de)......
了解更多 [06-17]電(dian)源(yuan)管(guan)(guan)理(li)芯片(pian)代理(li)商:nxp電(dian)源(yuan)管(guan)(guan)理(li)芯片(pian)的(de)(de)作(zuo)業原(yuan)理(li),在(zai)傳(chuan)輸(shu)方面,nxp電(dian)源(yuan)管(guan)(guan)理(li)芯片(pian)是根據傳(chuan)播速度來決(jue)定的(de)(de),對另一(yi)部分熱能進(jin)行自我吸收(shou);電(dian)源(yuan)管(guan)(guan)理(li)也叫電(dian)動(dong)夾板(ban),一(yi)般叫夾板(ban)來說。它存在(zai)的(de)(de)含(han)義在(zai)于對元(yuan)器件的(de)(de)加熱管(guan)(guan)理(li),對鋁和陶瓷(ci)都有熱量。近年來,電(dian)源(yuan)管(guan)(guan)理(li)芯片(pian)在(zai)國(guo)內十分火(huo)爆,已經發(fa)展成為個人護......
了解更多 [06-16]電(dian)源管理(li)芯片是智(zhi)能手機屏(ping)幕(mu)解(jie)(jie)決方案,電(dian)源管理(li)芯片代(dai)理(li)需要經過測驗才干顯現超卓的屏(ping)幕(mu)功能。手機屏(ping)幕(mu)觀看,有一個安(an)定的解(jie)(jie)決方案可(ke)以啟用(yong)觀看。微針模塊是屏(ping)幕(mu)檢測中不(bu)行短少的電(dian)子元件,可(ke)以起到(dao)安(an)穩的鏈接效(xiao)果。...
了解更多 [06-15]電源(yuan)管理(li)芯片(pian)在屏(ping)幕(mu)(mu)查看中(zhong)(zhong)起到安穩的連(lian)接(jie)作用,電源(yuan)管理(li)屏(ping)幕(mu)(mu)能(neng)夠很輕薄,能(neng)夠根(gen)據(ju)市場答(da)案是在柔(rou)性(xing)功(gong)用和可折(zhe)(zhe)疊(die)手機的開發中(zhong)(zhong),能(neng)夠隨意彎曲折(zhe)(zhe)疊(die),不會損壞屏(ping)幕(mu)(mu)的完整性(xing)。現在旗艦手機運用OLED屏(ping)幕(mu)(mu)已經(jing)成為規范裝(zhuang)備;...
了解更多 [06-14]電源管理芯片代(dai)理商(shang)能夠(gou)隨著工(gong)業(ye)環(huan)境的變化而(er)逐步(bu)改變上(shang)述情況。第(di)一(yi)(yi)個(ge)(ge)方面是許(xu)多(duo)新的制作工(gong)藝現(xian)已開發出(chu)來(lai),并且有(you)一(yi)(yi)個(ge)(ge)產能提升的過程,這將顯著影(ying)響其毛利率;第(di)二(er)個(ge)(ge)方面是硅(gui)晶圓(yuan)代(dai)工(gong)廠的均勻(yun)出(chu)廠價(jia)格。上(shang)一(yi)(yi)年(nian)(nian)整(zheng)個(ge)(ge)商(shang)場求過于(yu)供,支撐價(jia)格上(shang)漲。今年(nian)(nian)整(zheng)個(ge)(ge)代(dai)工(gong)作業(ye)不如上(shang)一(yi)(yi)年(nian)(nian)紅火(huo),導致(zhi)均勻(yun)出(chu)廠價(jia)低(di)于(yu)上(shang)......
了解更多 [06-13]電源管理芯片代理商的(de)(de)(de)現狀(zhuang)和趨勢開展,在(zai)年初市場(chang)炒作最基本的(de)(de)(de)決心(xin)和有滿足(zu)的(de)(de)(de)附(fu)(fu)加性能和功率的(de)(de)(de)能力,有必(bi)要(yao)分析一下,由于我們本年主要(yao)的(de)(de)(de)附(fu)(fu)加值(zhi)和動力來(lai)自存儲資(zi)料,在(zai)這個來(lai)自我國半導體產業鏈,真(zhen)正(zheng)的(de)(de)(de)內存才(cai)剛剛開端布局,到2019年可能不會有大(da)的(de)(de)(de)出售。另外(wai),從來(lai)看全球晶圓代工(gong),本年的(de)(de)(de)狀(zhuang)況不如(ru)......
了解更多 [06-11]我們結合先進的(de)電(dian)(dian)源(yuan)技術產(chan)品(pin),為(wei)工業汽(qi)(qi)車使(shi)用(yong)提供(gong)專用(yong)IC通道。我們的(de)安全(quan)和能源(yuan)管理(li)IC有(you)助于優化(hua)功率(lv)處理(li)并為(wei)當(dang)今和未來的(de)車輛提供(gong)節能的(de)能源(yuan)管理(li)。我們的(de)產(chan)品(pin)組合為(wei)汽(qi)(qi)車和工業用(yong)電(dian)(dian)提供(gong)最佳服務和擴展、安全(quan)和靈活的(de)解決(jue)方案(an)。集成的(de)高(gao)性價(jia)比解決(jue)方案(an)適用(yong)于各種直流到直流電(dian)(dian)源(yuan)轉換(huan)。...
了解更多 [06-10]nxp電源管(guan)理芯片可(ke)以開發新的工(gong)藝、封(feng)裝和電路(lu)設(she)計(ji)技術,也(ye)將出現(xian)性能(neng)更好的設(she)備,進(jin)步功率密度,延伸(shen)電池壽命,減少電磁干擾,增(zeng)強(qiang)電源和信號(hao)完整性,進(jin)步體(ti)系(xi)安(an)全性,讓國(guo)際各(ge)地的工(gong)程師(shi)可(ke)以立(li)異國(guo)際。...
了解更多 [06-09]